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The 7th International Electronic Conference on Applied Sciences

14 - 16 December 2026 (CET)
Online

Welcome from
the chairs
We are pleased to announce the 7th International Electronic Conference on Applied Sciences. This international conference is organized by the MDPI OA journal Applied Sciences (ISSN: 2076-3417; Impact Factor: 2.9), and it will bring together scientists from different areas to discuss important recent developments in a number of fields. It represents an opportunity to gather an interdisciplinary community to discuss applied sciences. More specifically, after the success of the first six editions, this year’s edition will focus on eight thematic areas of applied nature sciences:

  1. Applied Biosciences and Bioengineering;
  2. Nanosciences, Chemistry and Materials Science;
  3. Computing and Artificial Intelligence;
  4. Electrical, Electronics and Communications Engineering;
  5. Mechanical and Aerospace Engineering;
  6. Energy, Environmental and Earth Science;
  7. Food Science and Technology;
  8. Applied Physical Science.
We expect that participants in this conference will exchange novel provocative ideas by presenting short oral presentations on research and development discoveries. Posters can be presented without an accompanying proceedings paper and will be available on this website during and after the conference.

Specifically, you do not need to seek financial support for travel, purchase air tickets, leave your house, office, and family, make a hotel room reservation, take a trip, or adjust to the time zone where the conference takes place during the entire conference period.

Under the virtual conference settings, there are additional advantages: (1) engagement tools that keep energy levels high, (2) participants are given a voice, (3) far stronger attention is received while one is talking, (4) Q&A through “Chat” is also possible if you do not wish to raise your question verbally, (5) polls, (6) use of symbols under the “Reactions” function to show your voice, appreciation, or request, (7) greater reach with a remote audience, and (8) the ability to deliver live presentations simultaneously.

Full manuscript extended and expanded from conference submissions can be submitted to a Special Issue in the journal Applied Sciences after the conference, with a 20% discount on the article processing charges. All submitted papers will undergo MDPI’s standard peer-review procedure. The abstracts should be cited and noted on the first page of the paper.

We hope that the community shares our enthusiasm and helps make this seventh edition a resounding success, paving the way for many more conferences in the years to come.

Prof. Dr. Nunzio Cennamo
Professor of Electronics at University of Campania Luigi Vanvitelli, Naples, Italy
Prof. Dr. Pedro A. S. Jorge
Centre for Applied Photonics, INESC TEC, Porto, Portugal
The Chairs of the 7th International Electronic Conference on Applied Sciences

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Meet the Event Chairs

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Prof. Dr. Nunzio Cennamo
Department of Engineering, University of Campania Luigi Vanvitelli, Naples, Italy
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Prof. Dr. Pedro A. S. Jorge
Centre for Applied Photonics, INESC TEC, Porto, Portugal, Department of Physics and Astronomy, Faculty of Sciences, University of Porto, Porto, Portugal

Important Dates


  • Abstract submission deadlineAug 14, 2026
  • Abstract acceptance notificationSep 15, 2026
  • Early bird registration deadlineOct 16, 2026
  • Regular registration deadlineDec 08, 2026

Session Topics
Explore more details
  • S1. Applied Biosciences and Bioengineering
  • S2. Nanosciences, Chemistry and Materials Science
  • S3. Computing and Artificial Intelligence
  • S4. Electrical, Electronics and Communications Engineering
  • S5. Mechanical and Aerospace Engineering
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Sponsors and Partners

organizer


MDPIApplied Sciences

media partner


Applied NanoApplied System InnovationEngineering ProceedingsAcademic Conference Cloud
Conference Secretariat

Ms. Ann Li
Ms. Riley Liu
Email: asec2026@mdpi.com

For inquiries regarding submissions and sponsorship opportunities, please feel free to contact us.


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